• Accomplishment of an invisible glue line - Bond line read through
• No performance reduction after 2000 hour test at 180 °C 
• Ensurance of a defined bonding gap
• Processing time of 45 minutes due to manual application
• Fulflling of manufacturer specifications 

Kisling Solution: 7440

Epoxy Structural Adhesive

• Temperature range up to +180 °C
• Excellent bonding on composite and metals
• Low shrinkage capabilities
• Excellent chemical and aging resistance

• Improved optical glue line - No BLRT (Bond line read through)
• Reduction of part production cost as part can be painted directly. No post-processing of glue line necessary.
• Ideal compliance with cycle time (part vs. curing)
• Fulfillment of manufacturer specifications