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Polyurethane Encapsulant

2-components polyurethane casting resin, solvent-free system, soft curing degree, no halogenated flame-retardants, high electrically insulating, excellent adhesive properties, wide operating temperature range, suitable for low temperatures applications, ideal for electronic components, e.g., coils, sensors, PCBs or capacitors

 

As of August 24, 2023, all professionals and industrial users must complete a training before using this product. You can participate in the free training program here with the code FEICA_21_G.

Specifications

CharacteristicsCondition
Product categoryEncapsulants
Chemical basePolyurethane
Colorblack
Density [g/cm3]0.95 – 1.00
Mixing ratio100 : 20 (W:W)
Viscosity [mPas]1 800 – 2 400
Pot life [min]25 – 35
Shore hardness
(DIN EN ISO 868)
A25 – 35
Temperature range [°C]-80 – +130
Curing conditionscold curing
Thermal conductivity [W/mK]0.3
Glass transition temperature [°C]-69,1
CTE < Tg [ppm/K]101,4
CTE > Tg [ppm/K]222,4
UL94HB

Safety data sheet

CountrySwitzerlandEU
LanguageGermanFrenchItalianGermanEnglishFrenchItalian
Resin
Hardener

Technical information

GermanEnglish
Technical data sheet
Instructions for use

More information

GermanEnglish
Focus Flyer Electronics
Overview Encapsulants
Overview Brochure

 

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