Encapsulation of electronic components

In order to function safely, electronic assemblies and sensors must be protected against the ingress of water, humidity or corrosive gases, shock and vibration. Casting compounds based on either epoxy resins, silicones or modified (meth)acrylates are suitable for this purpose. Kisling offers a sophisticated range and these hese products cover the following fields of application:

• Sensors
• Capacitors
• Transformers (PCB Transformers, etc.)
• Electronic components with optimised thermal management (heat conductive encapsulants)