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7611

Epoxy Encapsulant

7611 is a black, fast curing, unfilled epoxy potting compound. The product is most appropriate for potting of smaller volumes such as for cables, connectors, plugs, sensors in the electronic market. CMR-free*

*not required to be labelled CMR according to section 2 of the MSDS

Specifications

CharacteristicsCondition
Product categoryEncapsulants
Chemical baseEpoxy
Colorblack
Density [g/cm3]1.15
Mixing ratio100 : 96.2 (Vol)
Viscosity [mPas]8 000 – 11 000
Pot life [min]3.5
Shore hardness
(DIN EN ISO 868)		D75
Temperature range [°C]-60 – +100
Curing conditionscold curing
Thermal conductivity [W/mK]0.2
Glass transition temperature [°C]52
CTE < Tg [ppm/K]52
CTE > Tg [ppm/K]215

More information

GermanEnglish
Overview Encapsulants
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Overview Brochure
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contact us

 

Headquarter | Production of adhesives and sealants
Kisling AG
Motorenstrasse 102
CH-8620 Wetzikon
Tel +41 58 272 01 01
info(at)kisling.com

Production of encapsulants
Kisling Deutschland GmbH
Salzstraße 15
74676 Niedernhall
Mail address: Waldstraße 15
DE-71139 Ehningen
P +49 7940 50961 61
info(at)kisling.com

Production of adhesives and sealants
Kisling Deutschland GmbH
Salzstraße 15
74676 Niedernhall
Mail address: Waldstraße 15
DE-71139 Ehningen
P +49 7940 50961 62
info(at)kisling.com

Private Label
Kisling Deutschland GmbH
Salzstraße 15
74676 Niedernhall
Mail address: Zeilbaumweg 15
DE-74613 Öhringen
P +49 7940 50961 60
info(at)kisling.com